G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E22-0697 (Reapproved 0309)

SEMI E22-0697 (Reapproved 0309)

Control of parameters such as bonded wafer stack (BWS) thickness

To determine the impurity capacity of a gas purifier at the point of breakthrough

1-95 (Withdrawn 0304)

This Standard describes a Guide for analysis of virgin high-purity ion exchange (HPIX) resin suitable for use in ultrapure water (UPW) polish applications

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E22-0697 (Reapproved 0309)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.