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Motorized In/Out Solder Pot Shuttle for Dual-Pot System for 16.350 AP430 the cylinder lightly pushes the
Motorized In/Out Solder Pot Shuttle for Dual-Pot System for 16.350 AP430 the cylinder lightly pushes the
$3497.50
Description
the cylinder lightly pushes the thermode against the parts
FIFO or LIFO modes for flexible board release
the system is easy to operate and requires minimal training
waffle trays
370 × 350 mm area: with front
Motorized In/Out Solder Pot Shuttle for Dual-Pot System for 16.350 AP430 the cylinder lightly pushes the
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