P00100 - SEMI P1 - Specification for Hard Surface Photomask Substrates Revision:SEMI P1-0708E - Inactive The Test Method is based

The Test Method is based on a light sectioning technique (see Related Information 1) where patterns of line segments or spots of light are projected onto a wafer surface and saw marks as well as the waviness peaks and valleys are oriented perpendicular to the direction of wafer transport

This Test Method requires the use of an oxygen-free reference specimen

the types of liquid chemicals listed below:

These mounting requirements may be used in other tools used to fabricate or measure EUV masks

This Document also provides a guide for a grade of hexamethyldisilazane for which a need has been identified

P00100 - SEMI P1 - Specification for Hard Surface Photomask Substrates Revision:SEMI P1-0708E - Inactive The Test Method is basedNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. NOTICE: This Document was completely rewritten in 2008. This Specification covers the general requirements of the glass substrate for hard surface photomasks. This Document covers square photomasks up to 7 inches in length.