E09600 - SEMI E96 - Guide for CIM Framework Technical Architecture Revision:SEMI E96-1101 - Superseded Alternative methods may also be

Alternative methods may also be used as long as they comply with SEMI C1 requirements for method validation

SEMI E129-0912 (technical revision)

SEMI MF1630-00 (first SEMI publication)

The Test Method is based on simultaneously measuring the wafer top and bottom surface position with an aligned pair of laser triangulation sensors when the wafer passes through the gap formed between the laser triangulation sensor pair

Equipment intended for further productive use includes that being offered for reuse

E09600 - SEMI E96 - Guide for CIM Framework Technical Architecture Revision:SEMI E96-1101 - Superseded Alternative methods may also beNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Guide describes technical architecture choices that enable application components to cooperate in a computer integrated manufacturing (CIM) environment and reduce the effort required to integrate those components into