G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Revision:SEMI G20-96 - Inactive SEMI M51 — Test Method

SEMI M51 — Test Method For Characterizing Silicon Wafers by Gate Oxide Integrity

SEMI E39 — Object Services Standard: Concept

NOTICE: This document was replaced by SEMI C56 in 2005

Subordinate Standard:

SEMI T3 —Specification for Wafer Box Labels

G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Revision:SEMI G20-96 - Inactive SEMI M51 — Test MethodThis specification defines lead finishes for plastic packages (e. g., single in line, dual in line, quad in line) using leadframes with SEMI specified leadframe materials. Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes SEMI G55 Test Method Measurement of