G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer Revision:SEMI G94-0113 (Reapproved 1123) - Current SEMI HB10-1018 (first published)

SEMI HB10-1018 (first published)

The purpose of this method is to provide a standardized method for quantifying the warm-up time of a mass flow controller (MFC)

the aluminum areal density that can affect the thermal oxide growth rate

SEMI G63-95 (Reapproved 0302)

help in equipment selection

G09400 - SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer Revision:SEMI G94-0113 (Reapproved 1123) - Current SEMI HB10-1018 (first published)This Specification defines the dimensions of container and requirements for securing the interface between container and processing equipment or wafer transportation equipment. This Standard specifies the requirements for wafer spacers used for separation of wafers and for a cushion material used for wafer protection. This Standard specifies the electrical characteristics and requirements for hazardous substance for the material of container. The