P04300 - SEMI P43 - Photomask Qualification Terminology StdTpc-CIM Framework SEMI M87 — Test Method

SEMI M87 — Test Method for Contactless Resistivity Measurement of Semi-Insulting Semiconductors

Nanotopography on a wafer surface prior to CMP processes can result in variations in post-CMP dielectric thickness with potential negative consequences for circuit performance and yield

board manufacturers

and automation equipment

This Guide is intended for use in both establishing new Specifications within SEMI as well as verification of performance to SEMI Specifications

P04300 - SEMI P43 - Photomask Qualification Terminology StdTpc-CIM Framework SEMI M87 — Test MethodThis Standard was technically approved by the global Micropatterning Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 13, 2011. Available at www. semiviews. org and www. semi. org in June 2011; originally published March 2004. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines