SPI Software with Communication Module MC388HS Helps prevent popcorning

Helps prevent popcorning

repeatable thermal performance

Supports flexible storage configurations and organization

Scalable capacity: optional upper rack doubles throughput

and once contact is made

SPI Software with Communication Module MC388HS Helps prevent popcorningSolder inspection results from the Solder Paste Inspection (SPI) machine can be collected and statistically analyzed, allowing the system to send operating instructions or print position correction values back to the printer. All statistical processing is performed according to each board's printing direction, ensuring consistent and reliable solder paste quality throughout production.