E07200 - SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight StdTpc-Wafer Edge Profile SEMI MF1366-0308 (Reapproved 1023)

SEMI MF1366-0308 (Reapproved 1023)

This Document specifies the critical dimensions and locations of the kinematic coupling pins (KCPs) that will support and position the 450 mm carriers

This Test Method describes a procedure which may be used to rank the pitting corrosion resistance of wetted surfaces of tubing or components of finished surfaces intended for use in corrosive gas systems

SEMI E122-0703 (technical revision)

and SEMI E112

E07200 - SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight StdTpc-Wafer Edge Profile SEMI MF1366-0308 (Reapproved 1023)This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www. semiviews. org and www. semi. org in October 2016; originally published in 1998; previously published March 2005. NOTICE: This Document was completely rewritten in 2016 To help semiconductor device manufacturers plan or