MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices Revision:SEMI MS9-0611 - Inactive and to prevent power from

and to prevent power from being applied to a module when its Emergency Off is non-functional

34-1109 (technical revision)

which are intended to provide wafers avoiding the difficulties enumerated above

and package engineers

SEMI PV13-0714 (technical revision)

MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices Revision:SEMI MS9-0611 - Inactive and to prevent power fromThis Standard was technically approved by the global MEMS NEMS Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 13, 2011. Available at www. semiviews. org and www. semi. org in June 2011. This Standard provides specification for interconnection dimensions and performance requirements for permanent microfluidic interfaces. It also provides guidance for interface design. This will help to enable low