G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded SEMI D19-1019 (technical revision)

SEMI D19-1019 (technical revision)

Static-control methods can be incorporated in the factory design to reduce static charge to acceptable levels

Additions to the Standard are made utilizing the SEMI Standards balloting process

and behavior is not required to be compliant to this Specification

2  This Standard specifies the application of the appropriate processing to specified material received at the processing agent

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded SEMI D19-1019 (technical revision)The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds