Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} Cabletron Systems 9000342-04 Processor

img{max-width:100%} Cabletron Systems 9000342-04 Processor PCB Card Lumonics LW-CO2 Used Working

PCB Part No: JANCD-NTU01-1

Range/Gas: 75 SCCM

Removed from a Hitachi MU-712E Shallow Trench Etcher System

Eprom 1: IDAC2 Log

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working img{max-width:100%} Cabletron Systems 9000342-04 ProcessorRudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.