Heat shrinkable low and medium voltage moulded shapes - General requirements (IEC 62677-1:2017) Ingestion-build-223009 fine pitch ball grid array

fine pitch ball grid array (FBGA) parts (rigid or flexible substrate)

BS 7818 discusses foundations

Contents of BS EN 3777:

Annex A (normative) Ruling sections for the mechanical properties

Provisions are made for the testing of sufficient specimens to permit the calculation of the brittleness temperature on a statistical basis

Heat shrinkable low and medium voltage moulded shapes - General requirements (IEC 62677-1:2017) Ingestion-build-223009 fine pitch ball grid array1 Scope This document is applicable to heat shrinkable low and medium voltage moulded shapes in a range of configurations and materials suitable for insulation, environmental sealing, mechanical protection, electrical conductance, anti tracking and strain relief for power cable terminations, joints and stop ends. It specifies the test methods and material requirements. The most commonly available shapes are as shown in the Annex A. Materials which