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BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible The specification information included in
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible The specification information included in
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Description
The specification information included in this document is applicable only when the design guidance in PD 6702-1 has been followed
possible weak population
Contactless integrated circuit
Brazing processes are widely used to manufacture many products from simple to complex levels
From today's perspective
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible The specification information included in
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